EconoSLC™ Based µSSD SATA
Ball Grid Array (BGA) package | MO-276
EconoSLC™ Based µSSD SATA
| MLC | |
|---|---|
| SERIES | EN-U09XXXGGPX |
| Interface | SATA III |
| Connector | BGA |
| Physical Form Factor | 16mm x 20mm |
| Industry Standard | JEDEC MO-276 |
| Flash Type | Toshiba A19 EconoSLC™ |
| Density | 4GB ~ 32GB |
| Data Retention | 10 years FOB / 1 Year EOL |
| Operating Temperature | Commercial: 0°C to 70°C Industrial: -40°C to 85°C |
| Shock | 1500 G |
| Vibration | 20 G |
| Humidity | 85% RH 85°C, 1000 Hrs |
| Read Performance | up to 530 MB/s |
| Write Performance | up to 200 MB/s |
| Voltage | 3.3 VDC |
| Power – Read | < 1,620 mW |
| Power – Write | < 1,620 mW |
| Power – DEVSLP | 5mW |
| Part Number | EN-U09XXXGGPX |
Quick Contact
Envoy Data Memory’s SATA µSSD delivers all the advantages of flash disk technology with the Serial ATA I/II/III interface and is fully compliant with the standard JEDEC MO-276 16x20x1.4mm 156 Ball form factor. The BGA is designed to operate at a maximum operating frequency of 300MHz with 40MHz external crystal. Its capacity could provide a wide range up to 64GB (MLC) and 32GB (EconoSLC). Moreover, it can reach up to 500MB/s read as well as 160MB/s write high performance based on Toggle 2.0 MLC flash (with 32MB SDR enabled and measured by CrystalDiskMark v3.0). The power consumption of the SATA µSSD BGA is much lower than traditional hard drives.
Envoy Data Memory’s µSSD delivers all the advantages of flash disk technology with Serial ATA I/II/III interface and is fully compliant with the standard JEDEC MO-276 (SATA uSSD) form factor in a 16mm x 20mm FBGA. Envoy Data Memory’s µSSD offers SSD capability in an embedded Ball Grid Array (BGA) package, which makes it the smallest dimension SSD possible. Supporting a wide range of capacity, high read/write performance, as well as low power consumption, Envoy Data Memory’s µSSD is the ideal storage choice for high performance, space constrained, demanding embedded devices.
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